Speaker
Description
Predicting hot workability is a critical challenge in thermomechanical processing. Traditional approaches are primarily based on the theory of hot processing maps, which evaluate power dissipation efficiency and deformation instability factor under various deformation conditions. The power dissipation efficiency characterizes the kinetics of microstructural evolution, whereas the deformation instability factor reflects the stability of plastic flow. Although the hot processing map theory has been widely applied to the hot deformation of various materials across a broad range of forming conditions, existing methods still exhibit limitations that hinder their practical application or lead to prediction inaccuracies. In this study, a data-driven model is developed based on the hot processing map theory to predict hot workability. Specifically, the conventional direct relationship between deformation conditions and hot workability is extended to a multidimensional space that incorporates deformation conditions, microstructural states, and hot workability. Based on the SHAP analysis, the relationships among these three factors are further quantitatively characterized. The influences of deformation conditions and microstructural states on hot workability under various processing conditions are systematically elucidated. To demonstrate the general applicability of the proposed approach, 316L austenitic stainless steel, low-carbon alloy steel, and nickel-based alloys are investigated. Furthermore, experiments involving dynamically varying deformation conditions and double-pass hot deformation are conducted to validate the method’s capability in handling complex thermomechanical processes. The proposed model demonstrates strong potential for application in complex thermomechanical processing and provides a powerful tool for the design and optimization of processing routes. Future work will focus on extending the model to more complex material systems, such as duplex stainless steels and titanium alloys.
| Speaker Company/University | Politecnico di Milano |
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